EPON™ 8280

EPON™ Resin 8280 has been designed especially for formulating filled compounds for a wide variety of structural applications, including bonding, electrical encapsulating, tooling, flooring and most construction uses. EPON Resin 8280 is a low molecular weight resin with outstanding resistance to pigment and filler settling, which gives greater stability to filled systems. The resin also has superior resistance to foaming under vacuum and has an adjusted, controlled reactivity with amine curing agents, which serves to extend pot Iife and working life characteristics. In addition, viscosity stability — often a problem in anti-settling resins — presents no problem for EPON Resin 8280. It is as good in viscosity stability as other conventional liquid EPON Resins. Furthermore, it yields products with high physical strength, excellent chemical resistance and good electrical properties.