EPON™ Resin 872

EPON™ Resin 872 is a chemically modified BPA based epoxy resin that is semi-solid at room temperature. Systems using EPON Resin 872 can be formulated with other EPON Resins, HELOXY™ Modifiers, or used as the sole resin to provide varying degrees of flexibility and toughness. EPON Resin 872 can be used with all curing agents. EPON Resin 872 provides cured resin toughness and flexibility in comparison to liquid grade BPA epoxies, but reduces elevated temperature performance. EPON Resin 872 is especially useful in applications requiring extra resistance to thermal shock or impacts.