EPON™ Resin 825

EPON™ Resin 825 is a high purity bisphenol A epichlorohydrin epoxy resin. As a result, the viscosity of this product is lower than standard bisphenol A liquid resins without the use of diluents or modifiers. Resin/curing agent systems based on EPON 825 have greater clarity, chemical resistance, higher heat distortion temperature, and lower electrical conductivity than can be obtained with most other standard resins. Due to the high purity, the resin may form crystals. The crystals can be converted to liquid without damaging the resin by opening the drum bung and heating between 45 °C (113 °F) and 50 °C (122 °F). The tendency to crystallize can also be reduced by adding either 5% to 10% of paratertiary-butyl phenol glycidyl ether or 20% to 30% of EPON Resin 862, a bisphenol F (BPF) epoxy resin.